Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Year of Establishment:
Registered Capital:
295604.36 USD
Management System Certification:
OEM/ODM Availability:
OEM/ODM Service
Sample Available
MEI Awards

Desiccant, Clay, Activated Clay manufacturer / supplier in China, offering Composit Fabric Paper Desiccant Packet for PCB Packaging, Moisture Proof Tyvek Paper Desiccant Silica Gel, 5g Mineral Environmental Protection Desiccant with High Absorption and so on.

Gold Member Since 2016
Audited Supplier

Composit Fabric Paper Desiccant Packet for PCB Packaging

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Min. Order: 2,000 Pieces
Port: Shenzhen, China
Production Capacity: 1000000 Pieces/Day
Payment Terms: T/T, Western Union
Shape: Beads
Drying Method: Static Drying
Kind: Mineral Desiccant
Sorbent: Clay
Desiccant: Physical Desiccant
OEM: Available

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Basic Info

Model NO.: 20003-WF-TP
Packaging: Non-Woven Fabric
Trademark: TOPCOD
Transport Package: Carton
Specification: Clay
Origin: China
HS Code: 3802900090

Product Description

Active clay desiccant is the new generation environmental protection type mineral desiccant, it regard natural mineral as the raw material, processing and manufactured with activated hygroscopic agent, it has the characteristic such as non-toxic, free from pollution, decompose naturally. Compare with silica gel desiccant, its ability of absorption of moisture is most powerful, especially in lower temper environment, and non-deformable, non-deliquescent in saturate state. 

1. 16 years experience for desiccant
2. Free samples and fast delivery time
3. SGS, MSDS, REACH, RoHS, DMF free approval
4. Eco friendly
5. OEM is available

Clay's component
Composit Fabric Paper Desiccant Packet for PCB Packaging

Composit Fabric Paper Desiccant Packet for PCB Packaging

Applicable to moistureproof dehumidification of upscale electronic components, semiconductor packaging test, computer information industry equipment, precision machinery, glass lenses, optical lenses instrument industry, medicine, health products and biological chip industry.

It conforms to national standards, such as MIL-D-3464E in America, JIS Z 0701 in Japan and DIN 55473 in Germany.

Composit Fabric Paper Desiccant Packet for PCB Packaging

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