Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Year of Establishment:
2004-04-13
Registered Capital:
295604.36 USD
Management System Certification:
ISO9001:2008
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available
MEI Awards

Barrier Bag, Shielding Bag, ESD Shielding Bag manufacturer / supplier in China, offering ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing, New Cobalt Halogen Free Red to Yellow Indicator Card (HIC), ESD Shielding Anti-Static PE Vacuum Bag for PCB, Electronic Parts Packing and so on.

Diamond Member Since 2016
Audited Supplier
Supplier Homepage Products Aluminum foil bag & rust proof ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing pictures & photos
  • ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing pictures & photos
  • ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
  • ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
  • ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
  • ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
  • ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
  • ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

Get Latest Price
Min. Order / Reference FOB Price
2,000 Square Meters US $0.3-0.4/ Square Meter
Port: Shenzhen, China
Production Capacity: 10000PCS/Day
Payment Terms: L/C, T/T, Western Union
Application: Promotion, Household, Chemical, Industrial Use
Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof
Material: Laminated Material
Shape: Seal Bag
Making Process: Composite Packaging Bag
Raw Materials: High Pressure Polyethylene Plastic Bag

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Basic Info

Model NO.
TP- packing bag
Bag Variety
Upright Bag
Printing
Blank or Customized
Layers
Pet/Al/Ny/PE
Thickness
0.14mm, 0.2mm, etc
Puncture Resistance
>100n
Peel Strength
>3.0n/ 15mm
Trademark
TOPCOD/OEM
Transport Package
Carton
Specification
Customized
Origin
China
HS Code
3923290000
1-Introduction:
Aluminum foil bag ( Aluminum-plastic composite vacuum bag, vacuum bag, moisture-proof bag,vacuum bag,shielding bag etc) is laminated with four single layers, PET/AL/NY/PE.
It has good moisture barrier and light isolation properties. 

We have our own dry lamination plant and can customize material structure according to users' specific packing purpose.

ESD Aluminum foil bag is widely used in vacuum packing of static sensitive electronic components such as PCB, WAFER, CHIPS, REELs in SMT industry etc. For chemical raw material and medical intermediate packing, it is undoubtedly a very good choice. Various bag shapes can be produced such as open-end bag, zip-lock bag, upright bag,organ bag and so on.


ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

2-Parameters:
  Physical Property      MaterialParameters140±10μm
Lay 1 (Surface)Polyester (PET)12μm
Lay 2Aluminum foil (AL)7μm
Lay 3Nylon (NY)15μm
Lay 4 (Base)Polyethylene (PE)100μm


3-Specifications:
Item NameMoisture Proof Aluminum Foil Bag With 4 Layers
Product SizeCustomized
ShapeUpright bag,organ bag, back seal bag
PrintingBlank or Customized
PackagingCarton Packaging
StructurePET/AL/NY/PE (Surface-Base)
Thickness> 0.14 mm
Seal Strength> 30N/ 15mm
Peel Strength>3.0N/ 15mm
Puncture Resistance>100N
Vapor Transmission0.002mg/100 in/24h
Tensile Strength Vertical >75N/ 15mm
Horizontal >85N/ 15mm
Heat-seal ConditionTemperature: 300-400F
Time: 0.6-4.5 seconds
Pressure: 30-70 PSI
Antistatic Performance1x105Ω< Outer surface<1x109Ω
1x105Ω< Inter surface<1x1011Ω
Metal layer<1x100Ω

4-Applications
Packaging of various PCB, IC, LED, hard disk, electronic parts and components, semiconductor,etc.
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

5-Company Display:

1: Established in 2001 with 18 years' experiences in this industry.
2: Combines R&D, production and sale together.
3: Owns 
advanced mechanized production line 
4: Product range: kinds of desiccants, humidity indicator card, Aluminum foil bag and other packing material.

ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing


6-Other hotselling products:
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

7-International Packaging Show
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

8-FAQ:
Q1: Can I have samples first before placing orders?
A1: Yes, we can offer you free samples and welcome your trial order.
 

Q2: When can I have the sample? How about the mass order?
A2: Usually the delivery of sample is 3-5 working days, and 15-20 days for the mass order.
 
Q3: Can you accept to print our own logo or brand on your products?

A3: Yes, customized style are welcomed here.

Q4:What is the packaging ?
A4:Carton packaging, the dimension is up to the product size.

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