ESD Antistatic Plastic Packing Bag for IC, PCB with Desicccant and Hic

• Customization: Available
• Application: Electronics
• Material: Plastic, Laminated Material
• OEM: Available
• Purpose: Electronics, Conductor, PCB, Chip, etc
• Thickness: 0.08-0.16mm
• Performance: Anti-Static, Moisture Barrier
• Feature: Moisture Proof, Recyclable, Antistatic
• Shape: Seal Bag
• Making Process: Composite Packaging Bag
• Raw Materials: High Pressure Polyethylene Plastic Bag
• Bag Variety: Upright Bag
• Transport Package: Carton
• Specification: Customized
• Trademark: TOPCOD/ Designed
• Origin: China
• HS Code: 3923290000
• Production Capacity: 10000 Pieces/Day

Product Description

Moisture-proof vacuum bag, also known as Aluminum foil bag, Aluminum-plastic composite vacuum bag, vacuum bag, moisture-proof bag, using imported high quality raw materials formed a production by automatic assembly line, the bag with a standard of moisture-proof logo, has six functions of anti-static, resistance of the electromagnetic interference and moisture proof, high barrier, with good puncture ability of water proof and oxygen proof. The bag should passed the GB & ASTM test and satisfied the strictest environmental protection standard of packing materials in EU and North America. It suitable for the electronics packing that has the requirement of moisture proof. Surface resistance is 108-1010Ω, static release time is less than 0.05 seconds.

Theory
Moisture-proof vacuum bag can protect electrostatic sensitive components from potential damage. Its special four-layer structure can create such effect as an inductive cover to separate the goods inside the static field. Besides, the innermost layer is made up of polyethylene that can prevent the static inside the bag, this heat-sealing bag is transparent, so that we can identify the internal items from the outside.






Feature
-Anti-static, moisture proof and electrostatic shielding, high mechanization degree and heat sealability.
-Customized sizes are available
-Different shape styles: flat bags, three-dimensional bags, gusset bags,etc.
-In strict accordance with the standards of GB/T 1037-1988, GB/T 1038-2000, MIL-B-81705-C for the production.

Material

Thickness	140±10μm (Total thickness of layer of glue and static is 5-10μm) Z
Physical properties	Material	Parameters
Lay 1	Polyester (PET)	12μm
Lay 2	Aluminum foil (AL)	7μm
Lay 3	Nylon (NY)	15μm
Lay 4	Polyethylene (PE)	100μm

 

Anti-static &moisture proof bag technical specification

No.	Test item	Technical requirements	Test standard
1	Performance of Anti-static	1x10^5Ω<resistance of outer surface<1x10^9Ω 1x10^5Ω<resistance of internal surface<1x10^11Ω Metal layer<1x100Ω	ANSI/ESD STM 11.1
		Friction voltage: <100V	ESD ADV 11.2
2	Electrostatic shielding	Remanent shield voltage: <20V	EIA 541
3	EMI Attenuation	>60 dB	MIL-PRF-81705
4	Life time	After using 1 year, still meet the requirements of No. 2/3/4	MIL-PRF-81705
5	Structure	PET/ AL/ NY/ PE
6	Thickness	> 0.14 mm
7	Size	Refer to drawing's marks
8	Heat-seal strength	> 30N/ 15mm
9	Tensile strength (vertical and horizontal direction)	Vertical >75N/ 15mm Horizontal >85N/ 15mm
10	Heat-seal condition	Temperature: 300-400F Time: 0.6-4.5 seconds Pressure: 30-70 PSI
11	Peel strength	>3.0N/ 15mm
12	Puncture resistance	>100N	MIL-STD-3010
13	Water vapor permeance	J-STD-033 0.002mg/100 in^2/24h	ASTM F 1249-13

 

Application
Mainly applicable to all kinds of packing of PC Board, electronic components, modems, CD-Rom, etc.


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