• ESD Aluminum Foil Packing Bag for Semiconductor Use
  • ESD Aluminum Foil Packing Bag for Semiconductor Use
  • ESD Aluminum Foil Packing Bag for Semiconductor Use
  • ESD Aluminum Foil Packing Bag for Semiconductor Use
  • ESD Aluminum Foil Packing Bag for Semiconductor Use
  • ESD Aluminum Foil Packing Bag for Semiconductor Use

ESD Aluminum Foil Packing Bag for Semiconductor Use

Application: Promotion, Household, Chemical, Industrial Use
Feature: Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof
Material: Laminated Material
Shape: Seal Bag
Making Process: Composite Packaging Bag
Raw Materials: High Pressure Polyethylene Plastic Bag
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Diamond Member Since 2016

Suppliers with verified business licenses

Manufacturer/Factory

Basic Info.

Model NO.
PB-AL
Bag Variety
Upright Bag
Printing
Blank or Customized
4 Layers
Pet/Al/Ny/PE
Thickness
0.085-0.14 mm
Puncture Resistance
>100n
Peel Strength
>3.0n/ 15mm
Vapor Transmission
0.002mg/100 In2 /24h
Applications
Electronics,PCB,Optical Lens, IC, LED,LCD
Pattern
Flat,Cubic,Gusset,Ziplock
Transport Package
Carton
Specification
22X25CM
Trademark
TOPCOD/OEM
Origin
Foshan China
HS Code
3923210000
Production Capacity
10000

Product Description

Recommended moisture-proof packaging solutions for you
 
Moisture-proof vacuum bagalso known as Aluminum foil bag, Aluminum-plastic composite vacuum bag, vacuum bag, moisture-proof bag, using imported high quality raw materials formed a production by automatic assembly line, the bag with a standard of moisture-proof logo, has six functions of anti-static, resistance of the electromagnetic interference and moisture proof, high barrier, with good puncture ability of water proof and oxygen proof. The bag should passed the GB & ASTM test and satisfied the strictest environmental protection standard of packing materials in EU and North America. It suitable for the electronics packing that has the requirement of moisture proof. Surface resistance is 108-1010Ω, static release time is less than 0.05 seconds. 

ESD Aluminum Foil Packing Bag for Semiconductor Use

Theory: 
Moisture-proof vacuum bag can protect electrostatic sensitive components from potential damage. Its special four-layer structure can create such effect as an inductive cover to separate the goods inside the static field. Besides, the innermost layer is made up of polyethylene that can prevent the static inside the bag, this heat-sealing bag is transparent, so that we can identify the internal items from the outside. 

Features: 
With excellent performance of anti-static, moisture proof and electrostatic shielding, high mechanization degree and heat sealability. The size of product is not restricted, can be customized the packing bag according to customer's requirements of different size and style. There are many kinds of aluminum-plastic composite packaging like flat bags, three-dimensional bags, accordion bags, etc. We will provide bags according to customer's requirements of product's shape. In strict accordance with the standards of GB/T 1037-1988, GB/T 1038-2000, MIL-B-81705-C for the production. 

Material: 
Thickness 140±10μm (Total thickness of layer of glue and static is 5-10μm) 
Physical properties Material Parameters
Lay 1 Polyester (PET) 12μm
Lay 2 Aluminum foil (AL) 7μm
Lay 3 Nylon (NY) 15μm
Lay 4 Polyethylene (PE) 100μm 

ESD Aluminum Foil Packing Bag for Semiconductor Use

Anti-static & moisture proof bag technical specification: 
No.   Test item Technical requirements Test standard 
  Performance of
Anti-static
1x105Ω<resistance of outer surface<1x109Ω
1x105Ω<resistance of internal surface<1x1011Ω
Metal layer<1x100Ω
ANSI/ESD STM 11.1
Friction voltage: <100V ESD ADV 11.2
2 Electrostatic shielding Remanent shield voltage: <20V EIA 541
3 EMI Attenuation >60 dB MIL-PRF-81705
4 Life time After using 1 year, still meet the requirements of No. 2/3/4 MIL-PRF-81705
5 Structure PET/ AL/ NY/ PE   
6 Thickness >0.14 mm   
7 Size Refer to drawing's marks   
8 Heat-seal strength >30N/15mm   
9 Tensile strength (vertical and horizontal direction) Vertical >75N/15mm
Horizontal >85N/15mm 
 
10 Heat-seal condition Temperature: 300-400F
Time: 0.6-4.5 seconds
Pressure: 30-70 PSI 
 
11 Peel strength >3.0N/ 15mm   
12 Puncture resistance >100N MIL-STD-3010
13 Water vapor permeance J-STD-033 0.002mg/100 in/24h ASTM F 1249-13 

Measure
ESD Aluminum Foil Packing Bag for Semiconductor Use

Applications: 
Mainly applicable to all kinds of packing of PC Board, electronic components, modems, CD-Rom, etc. 
ESD Aluminum Foil Packing Bag for Semiconductor Use


Advantages:  
ESD Aluminum Foil Packing Bag for Semiconductor Use

For TOPCOD
Why did you choose us?  


Why choose us? 

1-18 years experience in desiccant industry, including 1500-plus customers as far as 2019. Topcod has already established long-term cooperation with more than 100 well-known enterprises and brands.  

ESD Aluminum Foil Packing Bag for Semiconductor Use

There are 1500-plus customers as far as 2019. Topcod has already established long-term cooperation with more than 100 well-known enterprises and brands. 

ESD Aluminum Foil Packing Bag for Semiconductor Use

We were established in 2004, and set up branches in Shenzhen, Shunde, and Germany. We are a high-tech enterprise integrating scientific research, production, marketing, technical services, packaging consulting, quality testing, and providing solutions. 

2-OEM/ODM available. 
3-Eco-friendly. 
4-Free sample and fast delivery time
5-SGS, MSDS, REACH, RoHS, DMF free approval. Most importantly, we have silica gel REACH registration. 

6-Technique research development---Participate in formulating and revising industry standard and national standard about desiccants & oxygen absorber, organizing colloquias with leading enterprises in various industries, providing professional solutions. 

ESD Aluminum Foil Packing Bag for Semiconductor Use

7-Independent research and develop wrapping paper of desiccants---Detuch paper(which is eco-friendly, water-proof, dust-proof, smooth, lint-free)
8-Workshop Display - more than 200 desiccants' machines. Foshan, Shanghai, Shenzhen, HongKong, Germany all we have set sales and branch services can satisfy your requirement. 

Lab and Workshop display:  
ESD Aluminum Foil Packing Bag for Semiconductor Use

TOPCOD always adhere to the belief that, 
Only improve and explore the technology, 
Can we mrrt customers needs, 
Can we keep pace the times, 
Can we lead the way in this industry all the time... 

ESD Aluminum Foil Packing Bag for Semiconductor Use

Owns advanced mechanized production line
Combines R&D, production and sale together 

ESD Aluminum Foil Packing Bag for Semiconductor Use

Other product range: 
Industrial desiccant (silica gel desiccant / montmorillonite desiccant / activated clay desiccant); 
Food & pharmaceutical grade desiccant; 
Deoxidizer (Oxygen scravenger/absorber); 
Activated carbon deodorant; 
Humidity Indicator Card (HIC); 
Esd aluminum foil bag / Vacuum bag / VCI bag / rust proof bag (film);  


ESD Aluminum Foil Packing Bag for Semiconductor Use
 
FAQ About Packing Bag: 

Q: Could you produce our bags with our logo? 
A: Yes, any size and any printing colors we can do. 

Q: Are you a bag packing Manufacturer? 
A: Yes, with more than 18 years experience in printing&packaging area and located in Foshan city, Guangdong province. 

Q: Could you send me some samples? 
A: Yes, we will be glad to send you a good sample immediately so that you can check it our quality. But the sample delivery charges should be paid at your side.  

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now