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| Customization: | Available |
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| Material: | Laminated Material |
| Printing: | Blank or Customized |
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| Physical Property | Material | Parameters | 140±10μm |
| Lay 1 (Surface) | Polyester (PET) | 12μm | |
| Lay 2 | Aluminum foil (AL) | 7μm | |
| Lay 3 | Nylon (NY) | 15μm | |
| Lay 4 (Base) | Polyethylene (PE) | 100μm |
| Item Name | Aluminum Foil Bag For IC Chip Packing |
| Product Size | Customized |
| Shape | Upright bag,organ bag, back seal bag |
| Printing | Blank or Customized |
| Packaging | Carton Packaging |
| Structure | PET/AL/NY/PE (Surface-Base) |
| Thickness | > 0.14 mm |
| Seal Strength | > 30N/ 15mm |
| Peel Strength | >3.0N/ 15mm |
| Puncture Resistance | >100N |
| Vapor Transmission | 0.002mg/100 in2 /24h |
| Tensile Strength | Vertical >75N/ 15mm Horizontal >85N/ 15mm |
| Heat-seal Condition | Temperature: 300-400F Time: 0.6-4.5 seconds Pressure: 30-70 PSI |
| Antistatic Performance | 1x105Ω< Outer surface<1x109Ω 1x105Ω< Inter surface<1x1011Ω Metal layer<1x100Ω |
