Customization: | Available |
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Material: | Laminated Material |
Printing: | Blank or Customized |
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Physical Property | Material | Parameters | 140±10μm |
Lay 1 (Surface) | Polyester (PET) | 12μm | |
Lay 2 | Aluminum foil (AL) | 7μm | |
Lay 3 | Nylon (NY) | 15μm | |
Lay 4 (Base) | Polyethylene (PE) | 100μm |
Item Name | Aluminum Foil Bag For IC Chip Packing |
Product Size | Customized |
Shape | Upright bag,organ bag, back seal bag |
Printing | Blank or Customized |
Packaging | Carton Packaging |
Structure | PET/AL/NY/PE (Surface-Base) |
Thickness | > 0.14 mm |
Seal Strength | > 30N/ 15mm |
Peel Strength | >3.0N/ 15mm |
Puncture Resistance | >100N |
Vapor Transmission | 0.002mg/100 in2 /24h |
Tensile Strength | Vertical >75N/ 15mm Horizontal >85N/ 15mm |
Heat-seal Condition | Temperature: 300-400F Time: 0.6-4.5 seconds Pressure: 30-70 PSI |
Antistatic Performance | 1x105Ω< Outer surface<1x109Ω 1x105Ω< Inter surface<1x1011Ω Metal layer<1x100Ω |